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Electroplating Copper

IP.com Disclosure Number: IPCOM000084033D
Original Publication Date: 1975-Sep-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Eggert, WC: AUTHOR

Abstract

Using this technique hard, smooth copper can be plated on aluminum. Generally, the method consists of cleaning and zincating an aluminum workpiece, immersing the workpiece in a pyrophosphate-copper electrolyte, and then plating the workpiece with periodic reverse settings.

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Electroplating Copper

Using this technique hard, smooth copper can be plated on aluminum. Generally, the method consists of cleaning and zincating an aluminum workpiece, immersing the workpiece in a pyrophosphate-copper electrolyte, and then plating the workpiece with periodic reverse settings.

In one preferred embodiment, after cleaning and zincating the workpiece is subjected to a cyanide strike, for example, for 2 minutes at 20 ASF. The workpiece is then plated for 2 to 2-1/2 ampere-hours, at 110 ASF with a periodic reverse setting to provide 15 seconds of plating and 6 seconds of deplating. Known copper-pyrophosphate baths and bath conditions, preferably with the inclusion of a brightener are suitable.

This technique allows copper plating of aluminum in noncorrosive baths with short plating cycles. The resulting copper is smooth, bright, hard and durable.

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