Browse Prior Art Database

Metal Glass Interface

IP.com Disclosure Number: IPCOM000084078D
Original Publication Date: 1975-Sep-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Seehase, H: AUTHOR

Abstract

In gaseous discharge display panels, orthogonal conductor arrays are formed on glass plates or substrates and suitably insulated from contact with the gas by dielectric layers, which may have refractory surfaces to prevent sputtering of the electrodes or dielectric. When sealed in the appropriate gas composition and pressure, ionization signals may be selectively applied to groups of orthogonal conductors to provide a gaseous discharge display of selected characters.

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Metal Glass Interface

In gaseous discharge display panels, orthogonal conductor arrays are formed on glass plates or substrates and suitably insulated from contact with the gas by dielectric layers, which may have refractory surfaces to prevent sputtering of the electrodes or dielectric. When sealed in the appropriate gas composition and pressure, ionization signals may be selectively applied to groups of orthogonal conductors to provide a gaseous discharge display of selected characters.

One of the problems inherent in this technology relates to conductors which must adhere to the glass surface on which they are formed. One of the solutions to this problem utilized copper conductors with under and over layers of chrome, to provide adhesion to the glass surface and protect the upper layer of the copper from attack by the dielectric glass during the dielectric reflow. However, this conductor system requires three separate evaporations which introduces complexity into the panel fabrication. An alternate method of providing adhesion of copper conductors to the glass substrates is constructed as follows.

Referring to the drawing, panel substrates 1 and 3 have layers of silicon dioxide 5 and 7 formed thereon which may be deposited by E-beam vacuum deposition onto the glass substrates. During the initial part of the copper evaporation to form conductors 9 and 11, the silicon dioxide is codeposited so that the metal electrodes are effectively phased with the metal evaporation for a short codeposition of silicon dioxide and copper.

The evaporation of the silicon dioxide is then terminated and t...