Browse Prior Art Database

Removable Masking Covers for Sputtering Systems

IP.com Disclosure Number: IPCOM000084169D
Original Publication Date: 1975-Sep-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Entner, M: AUTHOR [+2]

Abstract

Sputtering vacuum chamber 5 includes cathode 6 and anode 13 (Fig. 1). With this system, shutters are replaced with covers 10 over substrates 12 (Fig. 2) for use during sputtering system tuning. Later covers 10 are removed and sputtering onto substrates 12 is done without retuning.

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Removable Masking Covers for Sputtering Systems

Sputtering vacuum chamber 5 includes cathode 6 and anode 13 (Fig. 1). With this system, shutters are replaced with covers 10 over substrates 12 (Fig. 2) for use during sputtering system tuning. Later covers 10 are removed and sputtering onto substrates 12 is done without retuning.

Individual covers 10 are placed over coating substrates 12. Covers 10 are made of material having low-sputtering yields, preferably spun molybdenum. The inner portion of a cover 10 (Fig. 2) is lined with a soft-magnetic disk 11 spot welded to cover 10.

Covers 10 are removed to expose substrate 12 lying on anode 13 as follows. A set of electromagnets 14 is mounted on arm 15 attached to hollow shaft 16 which pivots, as shown in Figs. 1 and 3. Knob 18 turns shaft 16. Electrical connections 19 pass through shaft 16 which is sealed by a vacuum feedthrough 17 in the base of chamber 5. Electromagnets 14 are adjusted so that when arm 15 turns with shaft 16, electromagnets 14 lie directly over covers 10. Removing a cover 10 occurs by activating electromagnet 14 over cover 10.

The advantage of electromagnets 14 as compared to other mechanical devices is that covers 10 are removed easily without disturbing substrates 12; covers 10 are flat without protrusions, preventing a voltage gradient over the anode surface, minimizing plasma distortion, avoiding non-uniformity of the deposited film; and very thin films deposit uniformly, since RF network tuning...