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Ferrite Treatment

IP.com Disclosure Number: IPCOM000084185D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Grimm, MA: AUTHOR

Abstract

Ferrite material which is used in magnetic recording transducers is subjected to grinding and lapping operations. These operations are used to size, shape and polish the ferrite and to contour the ferrite at the surface of the transducer. After such mechanical operations, the surface of the ferrite exhibits local compressive stresses.

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Ferrite Treatment

Ferrite material which is used in magnetic recording transducers is subjected to grinding and lapping operations. These operations are used to size, shape and polish the ferrite and to contour the ferrite at the surface of the transducer. After such mechanical operations, the surface of the ferrite exhibits local compressive stresses.

The result of these stresses is a change of the magnetic properties of the ferrite, including the portion of the ferrite used to interface with the magnetic recording media. For example, the initial permeability of the ferrite read/write surface can be decreased by as much as 50% thus, lowering the efficiency of the transducer and increasing the effective head to media separation.

The performance of a magnetic ferrite transducer can be improved after grinding and lapping, by removing a thin layer of stressed ferrite material from the read/write surface of the transducer. This ferrite removal is easily, accurately and efficiently performed by RF sputter-etch techniques. Removal of about 5 to about 15 microinches of ferrite from the surface of the transducer by sputter- etching, greatly improves the permeability of the ferrite and concomitantly the recording performance of the head.

RF sputter-etching techniques are useful for the treatment of the ferrite in a magnetic head including, for example, supporting ceramic, glass bonding material, and conductive metal lines or wires, as the temperature of the process can be...