Browse Prior Art Database

Photoresist Undulation Control

IP.com Disclosure Number: IPCOM000084192D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

White, DN: AUTHOR

Abstract

The process described below minimizes line width variations in the manufacture of integrated circuits by applying the resist composition in a vapor chamber, which contains a suitable solvent such as n-butyl acetate.

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Photoresist Undulation Control

The process described below minimizes line width variations in the manufacture of integrated circuits by applying the resist composition in a vapor chamber, which contains a suitable solvent such as n-butyl acetate.

The process comprises, as illustrated in the drawing, directing nitrogen from a suitable source through a flowmeter 1 and bubbling it through a n-butyl acetate volume 2. The entrained vapor of the compound is directed into a vapor chamber 3 having therein a rotatable pedestal 4 upon which a semiconductor wafer 5 is secured, usually by a vacuum chuck or any suitable means, and a photoresist layer is applied and spun onto the wafer in the vapor chamber 3.

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