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Browse Prior Art Database

Leaf Spring Contactor Assembly

IP.com Disclosure Number: IPCOM000084193D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Formikell, AE: AUTHOR

Abstract

Described is an etching technique for etching through thick materials and especially when making leaf-spring contactor assemblies, in which a number of cantilevered very small and thin separate fingers are created.

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Leaf Spring Contactor Assembly

Described is an etching technique for etching through thick materials and especially when making leaf-spring contactor assemblies, in which a number of cantilevered very small and thin separate fingers are created.

The process is shown in the figures, wherein Fig. 1 shows a body of copper material which is to be divided into a series of separate cantilevered fingers. A photoresist material 10 is placed on both surfaces 11 and 12 of a copper sheet
13. The photoresist is exposed to create a series of openings 14 therein. Once the openings 14 are created, the first surface 11 is exposed to a spray etchant solution to create a series of grooves 15 in one side of the copper sheet 13.

As shown in Fig. 2 this etchant spray is terminated before the sheet 13 is cut through. Preferably, more than 50% of the thickness is cut through but less than 75%. Once the spray etching has etched suitable grooves 15 into the surface of the cooper sheet 13, it is terminated and a pressure sensitive cloth tape 16 is applied to the etched surface, as shown in Fig. 3.

The copper sheet 13 is again exposed to a spray etchant so that the opposite surface 12 will be etched between the photoresist openings 14. The etchant will penetrate through to the previously formed grooves 15 and define individual separated fingers 17, 18, 19, and 20 now supported by the masking tape 16, as shown in Fig. 4.

Once the fingers have been separated, the tape 16 is removed and the p...