Browse Prior Art Database

Fixture for Electroplating Module Substrate Devices

IP.com Disclosure Number: IPCOM000084199D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Coombs, VD: AUTHOR [+3]

Abstract

This is a rack fixture and process for electroplating selected and predetermined areas on module substrate devices. These substrate devices comprise a ceramic wafer upon which has been deposited a metal layer or layers. The subsequent processing of the substrate to develop circuit patterns in the metallization layers usually involves etching of regions of the metallization layers. Also, the process can involve addition of metal layers to the substrate surface by electroplating over the metallization layers, as for example, where it is desired to gold-plate circuit lands which function as wire bond sites.

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Fixture for Electroplating Module Substrate Devices

This is a rack fixture and process for electroplating selected and predetermined areas on module substrate devices. These substrate devices comprise a ceramic wafer upon which has been deposited a metal layer or layers. The subsequent processing of the substrate to develop circuit patterns in the metallization layers usually involves etching of regions of the metallization layers. Also, the process can involve addition of metal layers to the substrate surface by electroplating over the metallization layers, as for example, where it is desired to gold-plate circuit lands which function as wire bond sites.

As a matter of convenience, it may be well to perform the electroplating before any removal of metallization layers, so that these layers can be used as the electrical common basis for deposition purposes. Ordinarily in such instances, only selected areas are intended to be electroplated. This is achieved by depositing a photolithographic resist coating over the metallization layer and by developing windows in the resist coating, and then electroplating through the windows and onto the metallization layers.

A fixture has been devised which provides for physicallv supporting and electrically contacting multiples of substrate devices upon which the "windowed" resist coatings have been produced, and for positioning the multiples of substrates in an electroplating bath for producing selected areas of plated metal on the metallization layers.

The rack 10 comprises a rectangular section of printed-circui...