Browse Prior Art Database

Adjustable Solder Nozzle

IP.com Disclosure Number: IPCOM000084200D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Kohn, H: AUTHOR [+2]

Abstract

This is an adjustable solder nozzle that is mounted over a solder pot, not shown. The solder pot includes a pump, not shown, that can move melted and liquid solder upward and into the tubular solder nozzle 9. The tubular solder nozzle 9 is positioned over an opening in the solder pot so that all liquid solder will flow into the nozzle 9 via slot 10. The liquid solder will then be forced out of nozzle 9 through the orifice 11. As the speed of the solder pump within the solder pot is increased, a greater volume of solder will leave the nozzle orifice 11 forming a solder wave, over which printed-circuit boards on the like are passed to perform the component-to-board joining operation.

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Adjustable Solder Nozzle

This is an adjustable solder nozzle that is mounted over a solder pot, not shown. The solder pot includes a pump, not shown, that can move melted and liquid solder upward and into the tubular solder nozzle 9. The tubular solder nozzle 9 is positioned over an opening in the solder pot so that all liquid solder will flow into the nozzle 9 via slot 10. The liquid solder will then be forced out of nozzle 9 through the orifice 11. As the speed of the solder pump within the solder pot is increased, a greater volume of solder will leave the nozzle orifice 11 forming a solder wave, over which printed-circuit boards on the like are passed to perform the component-to-board joining operation.

The angle of the solder wave produced can be determined from the horizontal to the center line of the nozzle orifice 11. This angle is adjustable and can be changed by inserting a rod 12 into the wheels 13 at the end of the nozzle 9 and rotating the nozzle either clockwise or counterclockwise, as needed, to produce the desired solder wave. The solder plates 14 form a seal against the nozzle 9 and the base 15 so that all solder will be directed through the orifice 11.

The width of the orifice 11 can be adjusted by the movement of the sliding plate 16. By moving the plate clockwise. the orifice of the nozzle will widen and produce a thicker solder wave. By moving the plate 16 counterclockwise, the orifice will narrow causing the thinner solder wave. When the desi...