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Thermal Conductivity Test Cell for Nonrigid Samples

IP.com Disclosure Number: IPCOM000084201D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Connors, PM: AUTHOR [+2]

Abstract

This is a test cell device adapted for measuring the thermal conductivity of nonsolid samples, such as gels liquids, and powders.

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Thermal Conductivity Test Cell for Nonrigid Samples

This is a test cell device adapted for measuring the thermal conductivity of nonsolid samples, such as gels liquids, and powders.

The apparatus comprises a circular cylinder formed of a cylinder wall 1 that is of a rigid or semirigid material having low-thermal conductivity (Kw), such as a glass or plastic tubing. The base 2 is formed of rigid material having a relatively high-thermal conductivity, such as a metal disk.

The material of the cylinder wall 1 is chosen so that its thermal conductivity is significantly less than that of the sample material 4 to be tested. In this manner, the conduction heat loss lengthwise through the cylinder wall 1 is reduced. The base 2 has a high-thermal conductivity such that the lower face of the sample 4 is substantially isothermal.

A heater 3 is designed and positioned so as to afford intimate contact with the nonrigid sample material 4. A sealant or adhesive compound can be used to secure the heater 3 to the wall 1, thereby preventing leakage or spillage of the sample material 4.

Sample temperatures at appropriate points are typically measured by an application of thermocouples, which will contact the sample material through small holes that may be drilled in the cylinder wall 1.

The basic model for computing the sample thermal conductivity (Ks) is the one-dimensional steady-state Fourier heat equation. If the wall thermal conductivity is known, then a correction factor can...