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Structure for Lift Off Mask Formation

IP.com Disclosure Number: IPCOM000084229D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Carr, PE: AUTHOR [+3]

Abstract

A patterned resist structure is formed by a process which includes the electron-beam patterning of a layer of polymethyl methacrylate resist. The acrylate resist is adhered to a glass-resin interlayer by the use of an adhesive layer of a copolymer of methyl methacrylate and methacrylic acid.

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Structure for Lift Off Mask Formation

A patterned resist structure is formed by a process which includes the electron-beam patterning of a layer of polymethyl methacrylate resist. The acrylate resist is adhered to a glass-resin interlayer by the use of an adhesive layer of a copolymer of methyl methacrylate and methacrylic acid.

According to the process, a layer of nonphotosensitive organic polymer is formed on a substrate by coating the substrate with a phenol-formaldehyde, novolac resin based photoresist, which is baked at about 210 degrees C for 30 minutes to render it nonphotosensitive.

A layer of siloxane adhesive is then applied followed by a layer of a glass resin which is baked.

An adhesive layer, which is a copolymer of methyl methacrylate and methacrylic acid, is coated onto the glass-resin layer and baked.

The polymethyl methacrylate resist layer is then applied and baked. The polymethyl methacrylate is patterned by electron-beam exposure and development. The copolymer is either removed with an organic solvent or a surfactant containing, weakly alkaline, aqueous solution.

The glass-resin and organic polymer layers are then removed by reactive sputter etching through the openings in the resist mask, to form a patterned lift- off mask. A layer of metal is then formed on the substrate and overlying lift-off mask. The lift-off mask is then removed by solvent treatment to leave only the portions of the metal layer which are in direct contact with the substr...