Browse Prior Art Database

Semiconductor Wafer and Module Test Station transport Mechanism

IP.com Disclosure Number: IPCOM000084289D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Prilik, RJ: AUTHOR [+2]

Abstract

A test station is described for a semiconductor wafer and semiconductor module having a supporting transport mechanism, which provides the ability to move the testing electronics from a wafer to a module test station, while maintaining a fine adjustment capability to align the test probes with the plurality of chips in a wafer.

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Semiconductor Wafer and Module Test Station transport Mechanism

A test station is described for a semiconductor wafer and semiconductor module having a supporting transport mechanism, which provides the ability to move the testing electronics from a wafer to a module test station, while maintaining a fine adjustment capability to align the test probes with the plurality of chips in a wafer.

The figure shows the transport mechanism as it is situated with respect to a module testing station 1 and a wafer testing station 2. Table 3 supports the tracks 4 on which the linear ball bushing 5 may be displaced, permitting motion of the testing electronics unit 6 from a first position 6 (station 1) to a second position 6' (station 2) in the X direction.

A cradle base plate 7 is mounted to the linear ball bushings 5.

A swivel bearing 8 pivotally supports a cradle assembly 9 which, in combination with the frictionless pads 10, permits relatively free angular motion of the cradle assembly 9 through the angular displacement theta' to accommodate alignment with the probe adapter ring 13. The slide assembly 11 allows motion of the test electronics module 6 in the Y direction. The test electronics module 6 is mounted directly to the.slide assembly 11.

A single test electronics module 6 can be used for both wafer and for substrate for device module testing. To test the device module 14, the test electronics unit is placed at the position 6 where a socket mounted on the test electr...