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Processing Technique for Gas Discharge Panels

IP.com Disclosure Number: IPCOM000084293D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Berenbaum, L: AUTHOR

Abstract

The drawing shows a sequence of steps for forming conductive metal lines 2 on a dielectric plate 3. This structure is useful in gas display panels in which plate 3 is glass. In step 1, glass plate 3 is first coated with a photoresist 4 that is exposed and removed in the pattern intended for the conductors. In step 2, the glass plate 3 is etched to form channels 5 having a depth equal to the desired thickness of the conductors. In step 3, the conductors are formed in the channels 5 by depositing a bottom layer of chrome, a layer of copper, and an upper layer of chrome.

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Processing Technique for Gas Discharge Panels

The drawing shows a sequence of steps for forming conductive metal lines 2 on a dielectric plate 3. This structure is useful in gas display panels in which plate 3 is glass. In step 1, glass plate 3 is first coated with a photoresist 4 that is exposed and removed in the pattern intended for the conductors. In step 2, the glass plate 3 is etched to form channels 5 having a depth equal to the desired thickness of the conductors. In step 3, the conductors are formed in the channels 5 by depositing a bottom layer of chrome, a layer of copper, and an upper layer of chrome.

The structure is then conventionally processed in wet oxygen to form a layer of chrome oxide on the upper chrome surface, and it is then sprayed with a thin- dielectric coating. Conventionally, these conductors are formed on a flat glass plate. In the conventional structure, the sides of the copper layer oxidize during the operation of forming the layer of chrome oxide. The copper does not form a tenacious bond with the oxygen, and oxygen may be trapped at the surface of the copper or within the open grain boundaries of the copper.

During subsequent manufacturing steps, the oxygen may be released to form bubbles under the dielectric layer and the bubbles may contribute to poor yield in manufacturing, or defects in the operating product. In the structure of the drawing, the sides of copper that would otherwise be exposed are protected within the etched ch...