Browse Prior Art Database

Detecting Defective Solder Interconnections on a Substrate

IP.com Disclosure Number: IPCOM000084295D
Original Publication Date: 1975-Oct-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Kadakia, SD: AUTHOR

Abstract

The drawing shows an apparatus for testing solder joints 3 that connect a semiconductor chip 4 to a substrate 5 of a circuit module. Customarily, solder joints 3 are visually inspected to detect joints that have a defective contact that may later produce an electrical failure. In the module of the drawing, the substrate 5 has two chips that are located so that some of the solder joints 3 are not accessible for visual inspection.

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Detecting Defective Solder Interconnections on a Substrate

The drawing shows an apparatus for testing solder joints 3 that connect a semiconductor chip 4 to a substrate 5 of a circuit module. Customarily, solder joints 3 are visually inspected to detect joints that have a defective contact that may later produce an electrical failure. In the module of the drawing, the substrate 5 has two chips that are located so that some of the solder joints 3 are not accessible for visual inspection.

The substrate 5 is mounted in an apparatus 6 that forms an air seal on one side of the substrate, and air pressure is applied to slightly flex the substrate. (The drawing exaggerates the amount of flexing.) The substrate 5 is flexed several times to produce a small amount of cyclic stress in the solder. This test does not adversely effect a good joint 3, but it causes a defective joint to fail so that it can be detected by electrical tests.

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