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Bernoulli Semiconductor Handling Tool

IP.com Disclosure Number: IPCOM000084420D
Original Publication Date: 1975-Nov-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cunningham, GF: AUTHOR [+2]

Abstract

In automated semiconductor processes, for example, in sputtering devices where it is necessary to accurately place a thin-silicon wafer or slice upon a quartz anode, a Bernoulli pickup head of a given diameter is used to place the wafer in a recessed section for sputter deposition of material by well-known means. The recession is usually larger in shape than the shape of the wafer in order to ensure placement at the same place repeatedly.

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Bernoulli Semiconductor Handling Tool

In automated semiconductor processes, for example, in sputtering devices where it is necessary to accurately place a thin-silicon wafer or slice upon a quartz anode, a Bernoulli pickup head of a given diameter is used to place the wafer in a recessed section for sputter deposition of material by well-known means. The recession is usually larger in shape than the shape of the wafer in order to ensure placement at the same place repeatedly.

Upon removing the wafer after process completion a larger diameter or shape Bernoulli pickup is necessary, because of the oversize of the recessed section. Usually the type of feed and unload is accomplished by moveable mechanical arms having the pickup and release sensing means associated with the automatic load and unload arms.

It is the concept of different size heads for placement and pickup that makes an automated process operable. The idea is applicable to any number of processing units and not limited to a sputtering device.

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