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Selective Solder Removal

IP.com Disclosure Number: IPCOM000084436D
Original Publication Date: 1975-Nov-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schuessler, PW: AUTHOR

Abstract

This system allows the selective removal of solder in applications such as, for example, the reclamation of large-scale integration (LSI) modules and the like.

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Selective Solder Removal

This system allows the selective removal of solder in applications such as, for example, the reclamation of large-scale integration (LSI) modules and the like.

A mixture of acetic acid and p-nitrobenzene sulfonic acid of approximately 10 parts and a thixotrope of approximately 1 part is used to dissolve the lead/tin solder. The mixture gels in a paste-like form and, thus, can be selectively applied to the solder to be removed. The mixture after being applied and the solder removed is rinsed away by deionized water.

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