Browse Prior Art Database

Vacuum Module Sealing Device

IP.com Disclosure Number: IPCOM000084492D
Original Publication Date: 1975-Nov-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Laurent, P: AUTHOR

Abstract

This is a vacuum sealing device for sealing a cover onto a semiconductor module.

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This is the abbreviated version, containing approximately 87% of the total text.

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Vacuum Module Sealing Device

This is a vacuum sealing device for sealing a cover onto a semiconductor module.

Covers 1 are placed on their support 2 and positioned by cover positioning elements 3, which hold the covers 1 in fixed positions. Modules 4 are placed on their support 5 in the same manner into predetermined positions, defined by module positioning elements 6 arranged so that the covers 1 and the modules 4 are, respectively, interaligned when the two supports 2 and 5 are assembled.

Cover support 2 is hollow and connected to a vacuum pump, not shown. The support 2 is provided with vacuum ports in its surface defined by positioning elements 3, so that the covers 1 are held on their support 2 by the suction applied through the vacuums ports.

Then, the two supports 2 and 5 are assembled in nonsealed condition and held together by assembling elements 7 and 8. The whole device is placed into a vacuum chamber, not shown. The covers 1 remain fixed to their support 2 as long as the vacuum pressure in the chamber is lower than the vacuum pressure inside support 2.

The operation of the device is based on the difference between the vacuum pressure holding the cover 1 and the surrounding vacuum pressure inside the chamber. When the vacuum pressure in the chamber exceeds the vacuum pressure inside the support 2, the cover 1 falls by gravity onto the module 4. Sealing is ensured between the module 4 and the cover 1 by applying an adhesive resin, not shown.

After having...