Browse Prior Art Database

Self Centering Air Lift Transport

IP.com Disclosure Number: IPCOM000084605D
Original Publication Date: 1975-Dec-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Apgar, DH: AUTHOR [+2]

Abstract

This transport is used to carry semiconductor wafers W and the like. The wafer W is shown in outline form in Figs. 1 and 2, for sake of clarity.

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Self Centering Air Lift Transport

This transport is used to carry semiconductor wafers W and the like. The wafer W is shown in outline form in Figs. 1 and 2, for sake of clarity.

Partially shown horizontal track 1 is provided with a series of aligned rectangular cutouts 2. In each cutout 2 is an identical manifold insert 3 which has a transverse center bore 4. Opposite the closed end, bore 4 has its open end terminated with a nipple or air hose connector 5 which is connected to an air supply, not shown. A linear row of plural, e.g., eight, elongated jet openings 11 - 18 are connected to bore 4. Interleaved between openings 11 - 18 are contoured channels or sinks 21 - 27, each having a contoured surface 6. Openings 11 - 18 and sinks 21 - 27 are symmetrically disposed about the center line 7 of track 1.

Each elongated opening is inwardly and upwardly inclined at predetermined angles, cf. angles A, Fig. 1 and B, Fig. 2, respectively. The angles A and B are judiciously selected so that the air flow from the jet openings 11 - 18 of a preceding row, flows or is directed to the sinks 21 - 27 of the next succeeding row. More particularly, the air from openings 11 - 14 of the preceding row is directed to sinks 21 - 24, respectively, of the next row and the air from openings 15 - 28 of the preceding row is directed to sinks 24 - 27, respectively, of the next succeeding row.

As a result, a laminar air flow is produced which causes wafer W supported thereby above track 1 to...