Browse Prior Art Database

Semiconductor Wafer Dome for an Evaporator

IP.com Disclosure Number: IPCOM000084620D
Original Publication Date: 1975-Dec-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Dahlke, GP: AUTHOR [+2]

Abstract

In certain evaporation processes on semiconductors it is necessary that the evaporant flux be incident to the wafer surface at a 90 degrees +/- 5 degrees angle, and that the film thickness be uniform at all wafer positions.

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Semiconductor Wafer Dome for an Evaporator

In certain evaporation processes on semiconductors it is necessary that the evaporant flux be incident to the wafer surface at a 90 degrees +/- 5 degrees angle, and that the film thickness be uniform at all wafer positions.

The dome illustrated in the figure allows the correct angle and distance from the source to be determined, so that the above conditions are fulfilled. Selected wafer positions in each tier are adjustable in angle with respect to the direction of incident flux and in distance from the virtual source, so that the uniformity can be optimized. The wafer holders are designed so that the wafers can be loaded from the back of the dome, eliminating the need to remove the dome from the chamber.

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