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Optical Multichannel Connection of Integrated Modules

IP.com Disclosure Number: IPCOM000084631D
Original Publication Date: 1975-Dec-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Korth, HE: AUTHOR

Abstract

Multilayer ceramic substrates 1 are fitted with chips 2 either on one or both sides and are surrounded by an optical transparent coolant 4 in module housing 3. Chips 2 are provided with light-emitting or PIN diodes. Connections 5, 6 for the circulation of coolant 4 and the power supply are arranged on module housing 3.

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Optical Multichannel Connection of Integrated Modules

Multilayer ceramic substrates 1 are fitted with chips 2 either on one or both sides and are surrounded by an optical transparent coolant 4 in module housing
3. Chips 2 are provided with light-emitting or PIN diodes. Connections 5, 6 for the circulation of coolant 4 and the power supply are arranged on module housing 3.

One or both lateral faces of module housing 3 are provided with inserted convex lenses 7, whose focal length as referred to the refractive index of coolant 4 is equal to half the module thickness. In the focal plane of lenses 7, light- emitting or PIN diodes of chips 2 or an aperture 8 are arranged. Adjustment is facilitated by the telecentric beam path. For connection to more remote modules light conductor cables 9 can be used.

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