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Deposition of Adhesive Polymer Films

IP.com Disclosure Number: IPCOM000084632D
Original Publication Date: 1975-Dec-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Heller, J: AUTHOR

Abstract

Adhesion of a sputtered polymer film deposited on a substrate is increased by a process with the following steps. 1. Substrate material or another well adherent substance is sputtered onto the substrate. 2. Monomer vapor is gradually introduced into the sputtering chamber with increasing pressure. Thus, while maintaining the substrate at polymerization temperature, polymerization starts and a mixture of sputtered and polymerized material is deposited on the substrate. 3. The monomer vapor pressure is increased further, so that the sputtering rate is finally reduced to zero and pure polymerization proceeds.

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Deposition of Adhesive Polymer Films

Adhesion of a sputtered polymer film deposited on a substrate is increased by a process with the following steps.
1. Substrate material or another well adherent substance is

sputtered onto the substrate.
2. Monomer vapor is gradually introduced into the sputtering

chamber with increasing pressure. Thus, while maintaining the

substrate at polymerization temperature, polymerization

starts and a mixture of sputtered and polymerized material is

deposited on the substrate.
3. The monomer vapor pressure is increased further, so that the

sputtering rate is finally reduced to zero and pure

polymerization proceeds.

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