Browse Prior Art Database

Module Spark Gap

IP.com Disclosure Number: IPCOM000084651D
Original Publication Date: 1975-Dec-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 68K

Publishing Venue

IBM

Related People

DeBar, DE: AUTHOR [+3]

Abstract

This module spark gap protects circuits on chips including protective devices from discharges exceeding the breakdown voltage of the air gap. The protective devices on chips protect circuit elements from lower voltage discharges.

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Module Spark Gap

This module spark gap protects circuits on chips including protective devices from discharges exceeding the breakdown voltage of the air gap. The protective devices on chips protect circuit elements from lower voltage discharges.

In Fig. A, a substrate 10, typically ceramic includes an array of metallized terminal pads 12 and related conductors 14 that are formed on a surface of the substrate 10 by screening or vacuum deposition or the like. Terminal pins, not shown, connect to the terminal pads 12 and extend beyond the other side of the substrate. A ground or return conductor 16 is also screened or deposited or otherwise formed on the substrate to establish an 8 mil air gap 18 with each terminal pad 12. One terminal pad 20 is connected to the conductor 16 and serves as a return or ground pin.

In another form, the conductor 16 may be formed on the other or bottom side of the substrate from which pins 22 extend, as shown in Fig. B.

Fig. C illustrates an embodiment of the module spark gap where a large- scale integrated (LSI) device 24 is suitably joined to the substrate 10 and has contacts 28 wire bonded to metallic conductors 26 leading to pins 30. The ground or return conductor 16 is located on the substrate 10 to be within 50 mils of the conductors 26. This spark gap has a breakdown voltage of 1500 volts. The ground line 16 is electrically connected to the ground pin 32 which is connected to the substrate of the LSI chip 24. Protective devices...