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Browse Prior Art Database

Measuring Cross Sectional Shape of a Conductor

IP.com Disclosure Number: IPCOM000084657D
Original Publication Date: 1975-Dec-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Heasley, RL: AUTHOR [+2]

Abstract

The drawing shows a cross section of a conductor 2 that is deposited on a semiconductor chip 3. With this method of forming conductor 2, the sides 4 and 5 slope inwardly to the top surface 6. A scanning electron microscope 7 and a display 8 are used for determining this shape. The scanning electron microscope 7 produces an image of the conductor 2 and chip 3 on the display 8.

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Measuring Cross Sectional Shape of a Conductor

The drawing shows a cross section of a conductor 2 that is deposited on a semiconductor chip 3. With this method of forming conductor 2, the sides 4 and 5 slope inwardly to the top surface 6. A scanning electron microscope 7 and a display 8 are used for determining this shape. The scanning electron microscope 7 produces an image of the conductor 2 and chip 3 on the display 8.

In this image, the chip 3 produces a dark background, the top of the conductor 6 produces a bright image, and the sides 4 and 5 produce a border of intermediate brightness. Thus the width of the top surface 6 and the width of the bottom surface of the conductor 2 can be measured directly from the image produced by the scanning electron microscope 7. Sides 4 and 5 can be assumed to have equal slopes, and the approximate thickness of the conductor 2 can be found by independent techniques. From this information, the truncated shape of the conductor 2 as shown in the drawing can be calculated.

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