Browse Prior Art Database

Anodization of Niobium Layers

IP.com Disclosure Number: IPCOM000084709D
Original Publication Date: 1975-Dec-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Jaggi, R: AUTHOR [+2]

Abstract

Difficulties are experienced in anodizing thin layers of niobium. The use of the oxide layer as an insulator often is impeded by faults causing short circuits. One known process can be adopted to yield satisfactory results.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Anodization of Niobium Layers

Difficulties are experienced in anodizing thin layers of niobium. The use of the oxide layer as an insulator often is impeded by faults causing short circuits. One known process can be adopted to yield satisfactory results.

A planar platinum cathode is placed in parallel to the surface to be anodized. The electrolytic solution consisting of 9 g ammonium pentaborate in 100 cm/3/ of ethylene clycol is filtered through a micropore filter. Before anodization, the electrolyte is stirred vigorously until the absence of schlieren indicates it to be homogeneous. The solution is then allowed to rest for five minutes before the anodization current is switched on. Current density at the beginning of the anodization current is switched on. Current density at the beginning of the anodization process is adjusted around 1 mA/cm/2/.

The yield of fault-free oxidation layers is notably improved by this process.

1