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Integrated Circuit Test Probe Assembly

IP.com Disclosure Number: IPCOM000084781D
Original Publication Date: 1976-Jan-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Drzewinski, GK: AUTHOR [+3]

Abstract

This fixed wire probe assembly includes a replaceable probe wire assembly which increases flexibility of testing equipment and reduces replacement cost.

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Integrated Circuit Test Probe Assembly

This fixed wire probe assembly includes a replaceable probe wire assembly which increases flexibility of testing equipment and reduces replacement cost.

The probe assembly includes a probe mounting plate 10 which contains a printed-circuit board 12 having conductive lands 14, coupled to testing equipment, not shown. Bolted to probe mounting plate 10 is a integral probe spider assembly comprising circular probe wire mounting ring 16, probe wires 18 and probe wire retaining ring 20. The probe spider assembly is fabricated by epoxy bonding Z-shaped probe wires 18 between rings 16 and 20, while supporting probe wires by an alignment tool, not shown.

Both ends of probe wires 18 are formed in a similar manner and make pressure contact at their lower end to a semiconductor device, and at their upper end to conductive lands 14. The advantage of using contact pressure at the upper end communicating with the testing circuitry is convenience of manufacture, ease of replacement with probe spider assemblies designed for differently configured semiconductor device pad arrangements, and lower cost of replacement in the event probe wires 18 are damaged.

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