Browse Prior Art Database

Multipoint Circuit Probe

IP.com Disclosure Number: IPCOM000084782D
Original Publication Date: 1976-Jan-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Drzewinski, GK: AUTHOR [+3]

Abstract

This method and apparatus presents an improvement in the manufacture of fixed-point probes. The use of the described probe covers a broad seg ment of chip and wafer circuit probing and offers the ability for flexible planning of circuits to be probed. Use of this method makes possible the mechanical reproduction of dense multirow fixed-point cantilever probes to exacting physical dimensioning.

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Multipoint Circuit Probe

This method and apparatus presents an improvement in the manufacture of fixed-point probes. The use of the described probe covers a broad seg ment of chip and wafer circuit probing and offers the ability for flexible planning of circuits to be probed. Use of this method makes possible the mechanical reproduction of dense multirow fixed-point cantilever probes to exacting physical dimensioning.

Fig. 1 shows a plan view of a probe wire spacer 10 used in the manufacture of the probe. Although multiple rows of probe wires 12 may be provided, Fig. 2 is an exploded view of a probe body showing only one row of wires 12 for simplicity. Probe wires 12 are inserted into slots of probe wire spacer 10. A thin coat of adhesive epoxy 14 is applied to the mating surface of probe wire spacer 10 and mounting block 16 to hold the wires 12 firmly in place and to act as a seal.

Tubular insulation, not shown, may be installed on the straight ends of the wires 12 to prevent shorting. Pressure clamps which are part of the build fixturing are applied to this assembly and a molding cavity is filled with molding compound. As illustrated in Fig. 3, the probe body is an integrated molded assembly.

Fig. 1 shows a detail of probe wire spacer 10 where section X depicts the segment of the spacer used within the probe body. Sections Y and Z are the means of holding section X through machining and assembly.

The advantages of the probe include:
1. Sectional construction fo...