Browse Prior Art Database

Hermetic Sealing Process

IP.com Disclosure Number: IPCOM000084794D
Original Publication Date: 1976-Jan-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Robbins, MA: AUTHOR [+2]

Abstract

This hermetic sealing process hermetically seals a module cover (e.g., ceramic) to a circuit module substrate on which is one or more integrated circuit modules.

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Hermetic Sealing Process

This hermetic sealing process hermetically seals a module cover (e.g., ceramic) to a circuit module substrate on which is one or more integrated circuit modules.

First, the cover and substrate are precleaned with a suitable solvent.

Next, a hermetic epoxy sealant preform ring is thermally bonded to the edges of the cover to be sealed. The cover is preheated to a temperature sufficient to melt the preform ring, so it will flow at a low-viscosity rate that allows it to self- align on the cover edges.

Thermal preconditioning of the bonded preform ring is next performed to minimize subsequent excessive epoxy flow at, for example, 98 Degrees C +/- 3 Degrees C for 15 minutes.

Thereafter, the cover and substrate are assembled in a contacting predetermined aligned registration, and the assembly thermally bonded together. Preferably, the thermal bonding is performed by placing the so assembled cover and substrate in a backfill vacuum oven, elevating the temperature of the oven to the cure temperature of the preform at a predetermined rate, backfilling the oven with nitrogen when the oven temperature reaches a predetermined value below the melt temperature of the epoxy, and maintaining the oven at the cure temperature for a predetermined time period to effect the hermetic seal; cf. "Thermal Bonding System", P.

W. Schuessler, IBM Technical Disclosure Bulletin, Vol. 17, No. 7, December 1974, page 1924.

If required, a subsequent reclaiming step may be...