Browse Prior Art Database

Use of Chamfered Carriers to Improve the Polishing Step

IP.com Disclosure Number: IPCOM000084836D
Original Publication Date: 1976-Jan-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Cazcarra, V: AUTHOR

Abstract

Frequently the polishing step causes an excessive friability of the edges of semiconductor wafers.

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Use of Chamfered Carriers to Improve the Polishing Step

Frequently the polishing step causes an excessive friability of the edges of semiconductor wafers.

A solution to this problem is to chamfer or bevel the carriers which hold wafers during the polishing step.

As shown on the drawing, the wafer 11 to be polished is introduced in one of a plurality of recesses 12, the internal rim of which is chamfered according to various slopes. The polishing pad 13 polishes the upper side of the wafer 11 and due to the chamfered rim will provide a profile similar to the one referenced at 14.

The concave shape of the wafer ridge considerably reduces the weakness of its edge and improves the manufacturing yields during the subsequent processing steps: like oxidation, epitaxy, etc....

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