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Prewire Bond Etch

IP.com Disclosure Number: IPCOM000084859D
Original Publication Date: 1976-Jan-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Eisenmann, DE: AUTHOR [+3]

Abstract

A solution of acetic acid and distilled water cleanses aluminum metallization in pads and vias of semiconductor chips for improved automatic wire bonding operations. The cleansing is performed without corrosion of the aluminum metallization.

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Prewire Bond Etch

A solution of acetic acid and distilled water cleanses aluminum metallization in pads and vias of semiconductor chips for improved automatic wire bonding operations. The cleansing is performed without corrosion of the aluminum metallization.

The process comprises the steps of immersing chips in a fifty percent by weight electronic grade acetic acid and fifty percent by weight distilled water solution for fifteen to thirty seconds, followed by (1) a rinsing in distilled water for five minutes, and (2) an isopropyl alcohol rinse to aid drying.

The acetic acid/distilled water cleansing solution removes AL(2)O(3) from the chip aluminum as well as organic materials, e.g., photoresist remaining in the plated via holes. The clean uniformly prepared metal surfaces improve wire bonding operations to metal surfaces of the chip.

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