Browse Prior Art Database

Magnetic Head Assembly

IP.com Disclosure Number: IPCOM000084971D
Original Publication Date: 1976-Feb-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 84K

Publishing Venue

IBM

Related People

McCormick, W: AUTHOR [+2]

Abstract

The technique shown is useful for assembling batch fabricated magnetic heads. In the example shown a center tapped magnetoresistive (MR) read head, such as that shown in U. S. Patent 3,814,863, is assembled. However, the above assembly technique can be applied to any magnetic head structure, and especially to any batch fabricated or thin film head structure.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 60% of the total text.

Page 1 of 2

Magnetic Head Assembly

The technique shown is useful for assembling batch fabricated magnetic heads. In the example shown a center tapped magnetoresistive (MR) read head, such as that shown in U. S. Patent 3,814,863, is assembled. However, the above assembly technique can be applied to any magnetic head structure, and especially to any batch fabricated or thin film head structure.

As shown in an exploded view (Fig. 1) housing block 2 is provided to accept transducing element 3 and pin block 4. In the embodiment shown, transducing element 3 consists of a ferrite block including insulation on its upper surface, not shown, and carrying center tapped MR element 5. Pin block 4 includes terminations 6 and locking notches 7. Transducing element 3 and pin block 4 are secured to housing 2 by standard adhesive techniques, such as by the use of epoxy, with locking notches 7 allowing the placement of adhesive which, after curing, provides assurance against further movement of the pin block 4.

As shown in Fig. 2, after transducing element 3 and pin block 4 are secured to housing 2, MR element 5 is placed into electrical contact with terminations 6 by wires 8. While not shown in detail, wires 8 may be uninsulated by utilizing the expedient of coating the area underlying the wires with a nonconductive polymer, and similarly by overcoating the wires with polymer. The basic head structure is completed by bringing ferrite closure 9 into position on the MR element 5.

As shown in ig...