Browse Prior Art Database

Foam Impedance Control on Card Discrete Wiring

IP.com Disclosure Number: IPCOM000085007D
Original Publication Date: 1976-Feb-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 87K

Publishing Venue

IBM

Related People

Boone, LE: AUTHOR [+3]

Abstract

The present solution replaces bonding to obtain the required impedance control of overflow and rework wiring on printed-circuit cards.

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Foam Impedance Control on Card Discrete Wiring

The present solution replaces bonding to obtain the required impedance control of overflow and rework wiring on printed-circuit cards.

When using wire 10 for engineering changes or overflows on cards, the characteristic impedance increases as the distance from the card wiring surface 11 increases. Most applications require the lowest impedance possible. An alternative to bonding these wires 10 to the card is to place a uniform layer of foam 12 between the card wiring side 11 and the existing card retainer 13. This solution can be used for any program which requires bonding of discrete wires 10 to cards. This also eliminates the exposure of a high-impedance line caused by a bond breaking loose from the card.

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