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Acceleration of Electroless Deposition

IP.com Disclosure Number: IPCOM000085010D
Original Publication Date: 1976-Feb-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR

Abstract

The advantages of electroless deposition over the subtractive process are well-known, and can be enhanced by inducing eddy currents onto the growing metallic film from an external high-frequency source. An arrangement as shown in Fig. 1 is illustrative of the method used to provide these advantages.

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Acceleration of Electroless Deposition

The advantages of electroless deposition over the subtractive process are well-known, and can be enhanced by inducing eddy currents onto the growing metallic film from an external high-frequency source. An arrangement as shown in Fig. 1 is illustrative of the method used to provide these advantages.

Copper foil 1 is immersed in a test tube 3 containing electroless copper plating solution 5. The test tube is placed in a container 7 through which water is circulated at a temperature of 50 degrees C. Around the outside of the container 7 is a high-frequency coil 9 which is powered by a 450 KHz induction heating unit. A number of experiments were performed to confirm that the electroless deposition was substantially greater in the presence of the high-frequency field than it was when the field was removed.

Using this concept the temperature of the electroless bath is unchanged by the accelerating mechanism, with the result that the acceleration does not affect the solution life. Alternatively, the solution life could be increased by operating the plating process at a lower temperature since it is generally known that the solution life varies inversely with the temperature at which the plating operation is performed.

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