Browse Prior Art Database

Module Destacking Tool

IP.com Disclosure Number: IPCOM000085012D
Original Publication Date: 1976-Feb-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+2]

Abstract

Multilayered modules require a reworking procedure for destacking the module so that it can be subsequently repaired and/or salvaged.

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Module Destacking Tool

Multilayered modules require a reworking procedure for destacking the module so that it can be subsequently repaired and/or salvaged.

The present tool provides for automatically destacking a multilayered module with a minimum time and temperature exposure. The module comprising layers A and B is loaded into the destacking tool by depressing a knob 1 and puller member 2, fastened thereto, downward against a compression spring 3 which extends between the puller member 2 and a support member 4. Puller member 2 is depressed downward until the module layers A and B slide freely into notches provided in the puller and support members, as shown. Upon release of the mechanism, the compression spring 3 will move the puller member 2 upward so that a positive load is applied between the module layers A and B.

The destacking tool is then moved to a position where the module leads 5 are immersed into a solder bath 6 which is at around 308 degrees C. Heat is now transferred up the module leads 5 to cause reflowing of the solder junctions 7 between the module layers A and B. When all the solder junctions 7 become molten, the tool will automatically separate layers A and B. A stop member 8 is provided to limit the upward travel of the puller member 2. The tool is now removed from the solder bath 6 and the module layers A and B are removed, cleaned and are ready for repair and restacking.

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