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Metallurgy for Multilayer Ceramic Modules

IP.com Disclosure Number: IPCOM000085016D
Original Publication Date: 1976-Feb-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Gniewek, JJ: AUTHOR [+3]

Abstract

An alloy containing platinum and molybdenum for multilayer ceramic modules offers several advantages.

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Metallurgy for Multilayer Ceramic Modules

An alloy containing platinum and molybdenum for multilayer ceramic modules offers several advantages.

Screening pastes may be prepared containing molybdenum and platinum powders by screening the material on green ceramic, and which is then cofired with the ceramic at about 1560 degrees C in a reducing environment. The fired metallurgy adheres to the ceramic and forms a conductive pattern on the surface and/or in vias that connect levels of the multilayer structure.

The platinum/molybdenum alloys (Pt/Mo) that are most desirable ranged from about 40 atomic percent Pt (53 wt.%) to about 70 atomic percent Pt (83 weight percent). Low-platinum alloys did not show good corrosion resistance and high- platinum alloys did not process well in the high-temperature firing due to excessive shrinkage.

The choice of powders is important in controlling shrinkage. A platinum powder with a low-surface area of about 0.5 M/3//g was used.

The molybdenum had an average particle size of 2.5 Micron m based on Fisher subsieve testing. Individual Pt and Mo powders were used but a prealloyed powder would also be suitable.

The alloy described here may be used throughout a multilevel structure or it may be used in the top and bottom levels with another metal, such as pure molybdenum in the internal levels.

Metallized areas that require maximum adhesion such as the pads for brazing I/O pins may have additives to promote adhesion. Examples of these addi...