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Integrated Circuit Packaging Structure and Process

IP.com Disclosure Number: IPCOM000085026D
Original Publication Date: 1976-Feb-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 57K

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Related People

Amaro, JM: AUTHOR [+4]


In this packaging structure, a header is used as a support for the conventional module substrate.

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Integrated Circuit Packaging Structure and Process

In this packaging structure, a header is used as a support for the conventional module substrate.

The header element 10 shown in Fig. 1 is a base containing hermetically sealed input/output pins 12 and a flange 14. The header can be formed of any suitable type of material as for example glass, ceramics, etc. The seal between the pins and the flange is formed by glass or a suitable metal.

As shown in Fig. 2, the substrate 16 is joined to the header 10 by a braze or solder joint. The substrate 16 can be of any suitable design or construction and is typically formed of a multilayer ceramic design. Integrated circuit devices 18 are joined to a pattern, not shown, on substrate 16.

The connection between the substrate 16 and the pins 12 in header 10 is shown in Fig. 2A in enlarged scale. The head of pin 12 is joined to a solderable pad on substrate 16 by a layer of solder 20. As indicated in Fig. 2A, variations due to warpage of the substrate 16, etc. are accommodated by longitudinal movement of pin 12, which is held in position by a solder or braze preform 22 contained in recess 24 in header 10. As indicated in Fig. 3, a cap 26 is joined to the flange 14 by a weld 28. The weld 28 can be achieved by any suitable method as for example laser or electron-beam welding.

The cap 26 can be separated from the header element 10 for rework by simply milling off the weld 28 around the diameter of the can. This welding and milling...