Browse Prior Art Database

Improved Thermal Characteristics of Interplane Boards

IP.com Disclosure Number: IPCOM000085073D
Original Publication Date: 1976-Feb-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Davis, JH: AUTHOR [+2]

Abstract

The internal planes of planar boards are constructed as illustrated in the given figure. All pins with the exception of ground pins and certain selected voltage pins, are separated from direct contact with the interplane copper conductive layer by a space of approximately 20 mils of a nonconductive material which will not conduct heat. Rec-P.

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Improved Thermal Characteristics of Interplane Boards

The internal planes of planar boards are constructed as illustrated in the given figure. All pins with the exception of ground pins and certain selected voltage pins, are separated from direct contact with the interplane copper conductive layer by a space of approximately 20 mils of a nonconductive material which will not conduct heat. Rec-P.

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