Browse Prior Art Database

Solder Thump

IP.com Disclosure Number: IPCOM000085186D
Original Publication Date: 1976-Mar-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 3 page(s) / 46K

Publishing Venue

IBM

Related People

Sarnacki, FH: AUTHOR

Abstract

For components which are tab mounted by soldering to pads on a printed-circuit board, for example, it is necessary to insure a positive fillet during soldering of the component to the board. For automated soldering of such components to the board, it is preferred that the tabs of the components include a relatively uniform, preapplied solder on the connecting surface thereof, so that the subsequent soldering of the tabs to the board will result in a uniform, reliable connection.

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Solder Thump

For components which are tab mounted by soldering to pads on a printed- circuit board, for example, it is necessary to insure a positive fillet during soldering of the component to the board. For automated soldering of such components to the board, it is preferred that the tabs of the components include a relatively uniform, preapplied solder on the connecting surface thereof, so that the subsequent soldering of the tabs to the board will result in a uniform, reliable connection.

Prior techniques for applying the solder to the mounting side of the tabs of such components have often resulted in nonuniform solder thicknesses from tab- to-tab, excess solder on a tab or insufficient solder on a tab, with the result being that it is difficult to uniformly establish reliable connections. For example, with nonuniform tab-to-tab solder deposits, one tab could be securely affixed, and the other tab might experience an intermittent connection. Where excess solder is located on a tab, it is possible that the solder will flow during the soldering operation and short out an adjacent pad. Where insufficient solder exists on a tab an insecure connection may result.

An apparatus adapted to overcome these difficulties in applying solder to a tab is shown in Fig. 1. This includes a holder 11 which is adapted to accept the components with tabs to be presoldered, and the holder being connected by a rod 13 to a counterbalance 15. The rod 13 is mounted to be pivoted about an arm 17 mounted on a support 19. Mounted on the base of the support 19 is a solder pot 21. Mounted across the back of the support member 19 is a spring 23 positioned to contact the counterbalance 15 as it rotates on the swivel arm 17.

In operation, the components whose tabs are to be presoldered are mounted in the holder 11. The counterbalance 15 is then moved to place the arm 13 in a vertical...