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High Density Bubble Memory Package

IP.com Disclosure Number: IPCOM000085187D
Original Publication Date: 1976-Mar-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 96K

Publishing Venue

IBM

Related People

Joshi, KC: AUTHOR [+2]

Abstract

The development of the magnetic bubble memory with its inherent high density requires unique packaging requirements, such as: 1. Package should be as flat and as dense as possible. 2. Requires field coils carrying high-switching currents. 3. Package must be void of bulk metal to avoid eddy-current effects. 4. Assembly processes must take place at low temperatures. 5. Where multiwafer memory stacks are used, it is desirable to be able to access one or more of the wafer elements for repair or replacement, if necessary.

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High Density Bubble Memory Package

The development of the magnetic bubble memory with its inherent high density requires unique packaging requirements, such as: 1. Package should be as flat and as dense as possible.

2. Requires field coils carrying high-switching currents.

3. Package must be void of bulk metal to avoid

eddy-current effects.

4. Assembly processes must take place at low temperatures.

5. Where multiwafer memory stacks are used, it is desirable

to be able to access one or more of the wafer elements

for repair or replacement, if necessary.

Fig. 1 illustrates an assembled bubble memory package which includes ten wafers and could include all of the necessary support electronics, plus the integrated coils. The bubble wafers 11 are mounted on both sides of ceramic substrates 13. The substrates 13 also include a plurality of through pins 15 adapted to be mated with cup shaped portions 17 on the through pins found in adjacent substrates 13. This technique is used to provide the interconnections in the package.

The field coils are assembled by connecting pluralities of wires 19 between pluralities of pins 21 and 23 in the uppermost substrate, and connecting pluralities of wires 20 between the pluralities of pins 25 and 27 in the base substrate. It is to be understood that there will be a first plurality of wires in the x direction and a second plurality of wires in the y direction, as illustrated in the top surface of a main substrate 13 shown in Fig. 2.

Thu...