Browse Prior Art Database

Substrate Tin Repair

IP.com Disclosure Number: IPCOM000085233D
Original Publication Date: 1976-Mar-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Cadwallader, RH: AUTHOR [+2]

Abstract

When a pin such as the broken pin 10 on a substrate 11 mounting one or more active devices, for example integrated circuit devices, is broken, it is difficult to make a quick and effective economical repair of the substrate so that it may be reused. The drawings illustrate a method with associated apparatus for removing and reapplying a pin on a substrate to thereby repair the substrate 11.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Substrate Tin Repair

When a pin such as the broken pin 10 on a substrate 11 mounting one or more active devices, for example integrated circuit devices, is broken, it is difficult to make a quick and effective economical repair of the substrate so that it may be reused. The drawings illustrate a method with associated apparatus for removing and reapplying a pin on a substrate to thereby repair the substrate 11.

Referring to the drawing, the broken pin 10 is removed by a rotary cutting tool 12 while applying a vacuum through a tube 13, to prevent contamination of the substrate 11 by small chips which occur due to the cutting action. As shown, the pin 10 includes a base or lip portion 10A thereon, the pin 10 being removed above the base. Thereafter, flux is applied to the remaining base portion 10A and, as shown in Fig. 3, a preform of solder 14 is applied to the base portion.

A new pin 15, including a small lip portion 15A is held by, for example, a magnetic chuck 16 for receipt into a pin holder and heater element 17. After receipt of the pin 15 by the holder 17, the pin holder 17 inserts the pin 15 down onto the base 10A and applies heat through the pin and to the solder 14, heating the base 10A and the base 15A so that solder reflow occurs. Thereafter, the holder 17 is removed and the repair is complete.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]