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Probe Tips

IP.com Disclosure Number: IPCOM000085250D
Original Publication Date: 1976-Mar-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Dougherty, WE: AUTHOR

Abstract

Two types of probe are shown that permit the testing of high-circuit density semiconductor chips and wafers. In both cases the probe should be made of a suitably flexible material.

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Probe Tips

Two types of probe are shown that permit the testing of high-circuit density semiconductor chips and wafers. In both cases the probe should be made of a suitably flexible material.

Figs. 1A and B show a "dog leg" 5 that comes down directly over the metal joint 6 which is carried upon wafer 7. When contact is made, the "dog leg" flexes providing both a wiping action and the flexibility necessary for height variation in the metal joint.

In Figs. 2A and B, the probe 8 contacts or nearly contacts the wafer 9 at the area between the metal joints 10 and is moved laterally in the direction of the arrow up against the edge of a metal joint 10, at which time it flexes and wipes the joint. In this way the effect of variations in joint heights are virtually eliminated.

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