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Selective Masking for Charge Electrode Structures Used in Ink Jet Printing

IP.com Disclosure Number: IPCOM000085357D
Original Publication Date: 1976-Mar-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Giordano, FP: AUTHOR

Abstract

Presently used electroplating techniques for forming electrostatic charge electrodes on a substrate are deficient in certain respects due to the fact that photoresist, because of its surface tension, recedes from the edges of the substrate and the edges of slots formed therein, making it difficult to protect the edges from electroplating.

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Selective Masking for Charge Electrode Structures Used in Ink Jet Printing

Presently used electroplating techniques for forming electrostatic charge electrodes on a substrate are deficient in certain respects due to the fact that photoresist, because of its surface tension, recedes from the edges of the substrate and the edges of slots formed therein, making it difficult to protect the edges from electroplating.

A selective masking technique is described, wherein a contaminant such as a fast-drying nonwater soluble ink is applied to the bottom of the substrate and to the edges where the photoresist recedes. This protects the edges from electroplating and obviates the need for lapping the substrate to delineate and make the charge channels discrete.

The electroplating technique is as follows:
1) Deposit electroless copper 5000 Angstroms thick over entire

surface including slots 14.
2) Spray AZ* 111 photoresist on top 2 of the structure.
3) Align delineated line pattern mask 16 on the top 2 and expose.
4) Develop in AZ 303 developer to define where nickel (in step 6)

will adhere.
5) Roll a contaminate such as a fast-drying nonwater soluble ink

on the bottom 6 and edges 8 with a roller 10. The roller 10

applies the ink to the edge surfaces 12 of the top 2 due to

the roller curvature.
6) Electroplate nickel approximately 2 microns. The nickel

follows the delineated line pattern 16 and slots 14.
7) Strip photoresist and ink and then etch field copper in

ammonium persu...