Browse Prior Art Database

Solderless Module To Circuit Connection

IP.com Disclosure Number: IPCOM000085427D
Original Publication Date: 1976-Apr-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Ward, WC: AUTHOR

Abstract

Described is a wiping spring contact which can be mechanically attached to thermally sensitive substrates with high-electrical reliability, so that the modules can be mounted on substrates without using heat.

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Solderless Module To Circuit Connection

Described is a wiping spring contact which can be mechanically attached to thermally sensitive substrates with high-electrical reliability, so that the modules can be mounted on substrates without using heat.

The solderless module-to-circuit board connection element is shown in the drawing and comprises a barrel sleeve 10 adapted to fit over and tightly clamp to standard module pins. Stops 11 and 12 prevent the sleeve 10 from sliding too far up the module pin. The side of the sleeve 10. opposite the stops is extended and bent to provide spring pressure against a suitable pad on the printed-circuit board. As the module is clamped into position, the spring 13 deflects and the rounded portion 14 abutting the pad wipes the substrate pad and creates an electrical path of high integrity. Solder and its attendant heat cycles are not required.

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