Browse Prior Art Database

Module Package

IP.com Disclosure Number: IPCOM000085430D
Original Publication Date: 1976-Apr-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Auletta, LV: AUTHOR [+2]

Abstract

Described is a low-cost, mass produced, reliable module package with the ability to make electrical contact to a circuit board by utilizing a pressure type clamp.

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Module Package

Described is a low-cost, mass produced, reliable module package with the ability to make electrical contact to a circuit board by utilizing a pressure type clamp.

The package comprises a T-shaped polyimide film 10 having electrical chip contacts, not shown, termination contacts 12 and leads 13 formed on the film 10 by suitable deposition etching techniques. A semiconductor chip 14 is mounted on the film 10 and contacts selected chip contacts. Leads 13 extend from the chip contacts to the termination contacts 12.

The mounted chip 14 is encapsulated in a body 15 of suitable epoxy encapsulant by a well-known molding process, so that the legs of the T-shaped film 10 are left extending from the body 15.

The formed unit can now be mounted on a printed-circuit board 11 by using a suitable U-shaped clamp 16. The clamp 16 has extensions 17 from one leg of the U that mate with the legs of the T-shaped polyimide film 10, such that the termination contacts 12 are tightly held to the printed-circuit board 11 by the extensions 17.

If required for thermal considerations, the clamp 16 can be provided with a heat sink 18.

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