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Apparatus for Stopping a Rapidly Moving Wafer on a Bernoulli Effect Air Track

IP.com Disclosure Number: IPCOM000085444D
Original Publication Date: 1976-Apr-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Lucas, CJ: AUTHOR [+2]

Abstract

The integrated circuit fabrication field has been moving in the direction of utilizing Bernoulli effect positive air pressure tracks for automatically moving wafers from one processing station to another. These wafers move along at a relatively high speed. At various processing points, it is desirable to stop the wafer and maintain it in a position from which it may readily be picked off the track.

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Apparatus for Stopping a Rapidly Moving Wafer on a Bernoulli Effect Air Track

The integrated circuit fabrication field has been moving in the direction of utilizing Bernoulli effect positive air pressure tracks for automatically moving wafers from one processing station to another. These wafers move along at a relatively high speed. At various processing points, it is desirable to stop the wafer and maintain it in a position from which it may readily be picked off the track.

The present apparatus provides such a stopping mechanism. The wafer is moved along the Bernoulli air track in the direction shown in the drawing. The air flow of the track is provided through a multitude of tiny apertures in the track. As the wafer approaches the locating pins which will stop the wafer, it crosses the photosensor which triggers the first vacuum stops and the second vacuum stops in sequential order.

These vacuum stops do not completely suck wafers down against the track so as to stop the wafer, but rather provide a pressure on the wafer which poses or bucks the momentum given to the wafer by the Bernoulli effect, so as to slow down the wafer and ease it into a stop against the locating pins.

The wafer is then maintained against the pins slightly elevated by the air flow coming out of the air apertures. In this elevated position above the track, the wafer may then be readily picked up and lifted from the track by appropriate pickup means.

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