Browse Prior Art Database

Cleaning Flux Residue from Circuit Device

IP.com Disclosure Number: IPCOM000085526D
Original Publication Date: 1976-Apr-01
Included in the Prior Art Database: 2005-Mar-02
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Driscoll, RG: AUTHOR [+4]

Abstract

The drawing shows a sectional view of apparatus for cleaning flux from a circuit device 2, such as a ceramic wafer that carries semiconductor chins. The circuit device is positioned in a cleaning tank 3 with the side that is to be cleaned facing to the right in the drawing. A flammable cleaning fluid is supplied to the cleaning tank through an inlet pipe 4, a buffer tank 5 and a pipe 6. Used cleaning fluid is removed from the tank through a pipe 7. Inlet pipe 4 and outlet pipe 7 are connected to safety cans in a chemical safety cabinet, not shown.

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Cleaning Flux Residue from Circuit Device

The drawing shows a sectional view of apparatus for cleaning flux from a circuit device 2, such as a ceramic wafer that carries semiconductor chins. The circuit device is positioned in a cleaning tank 3 with the side that is to be cleaned facing to the right in the drawing. A flammable cleaning fluid is supplied to the cleaning tank through an inlet pipe 4, a buffer tank 5 and a pipe 6. Used cleaning fluid is removed from the tank through a pipe 7. Inlet pipe 4 and outlet pipe 7 are connected to safety cans in a chemical safety cabinet, not shown.

Cleaning tank 3 and the larger buffer tank 5 are located in a tank 10 that contains a heater, not shown, and a nonflammable heat transfer liquid for heating the flammable cleaning fluid to an appropriate temperature. Buffer tank 5 has fins 11 to aid the heat transfer and it has an internal baffle 8 that prevents unheated cleaning fluid that enters the buffer tank 5 at pipe 4 from flowing directly to cleaning tank 3.

Cleaning tank 3 has a wall 13 with apertures 12 that lead to a pump 14. Pump 14 has a housing 15 and a bellows 16. Pulses of pressurized air are admitted to the pump 14 through a pipe 18 to force the bellows 16 to the left in the drawing, to pump the cleaning fluid through apertures 12 toward points on circuit device 2 where solder flux is to be removed. An air knife 19 is operated to remove the cleaning fluid from circuit device 2 as it is removed from tank 3. This ...