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Debris Containing During Laser Machining

IP.com Disclosure Number: IPCOM000085809D
Original Publication Date: 1976-Jun-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Balan, AL: AUTHOR [+3]

Abstract

In an operation to selectively remove metallization from a ceramic substrate with a pulsed laser, some of the removed material is usually being redeposited in the nearby work area. Such redeposited material can interfere with subsequent work processing steps, such as wire bonding in the bonding pad areas.

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Debris Containing During Laser Machining

In an operation to selectively remove metallization from a ceramic substrate with a pulsed laser, some of the removed material is usually being redeposited in the nearby work area. Such redeposited material can interfere with subsequent work processing steps, such as wire bonding in the bonding pad areas.

This problem can be overcome by first coating the deletion area and vicinity with a suitable viscous coating material, as for example, halogenated hydrocarbon grease or glycerine. During the deletion operation, the laser beam penetrates the viscous coating in the designated area and the coating material prevents released particles from becoming imbedded in the surface nearby. Following the deletion operation, the viscous coating with trapped particles from the deletion are floated off with an appropriate solvent, such as methanol.

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