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Epoxy Sealant

IP.com Disclosure Number: IPCOM000085810D
Original Publication Date: 1976-Jun-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Christie, FR: AUTHOR [+2]

Abstract

A 3, 4, 4' - trichlorocarbanilide accelerator is used in an epoxy sealant system to prolong its gel time. This makes the system useful for backfill applications, i.e., applications where the sealant is poured,or cast onto the parts to be sealed. For example, the system is useful in circuit module sealing applications, in which an aluminum cover is to be sealed to a ceramic substitute so as to hermetically seal an integrated circuit chip mounted on the substrate and within the cover.

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Epoxy Sealant

A 3, 4, 4' - trichlorocarbanilide accelerator is used in an epoxy sealant system to prolong its gel time. This makes the system useful for backfill applications, i.e., applications where the sealant is poured,or cast onto the parts to be sealed. For example, the system is useful in circuit module sealing applications, in which an aluminum cover is to be sealed to a ceramic substitute so as to hermetically seal an integrated circuit chip mounted on the substrate and within the cover.

Chopped glass is also used in the sealant system because it provides mechanical strength to the seal, and because of its desired thermal coefficient of expansion characteristics. As a result, thermal cracking in the sealant is mitigated and/or prevented because of differences in the thermal coefficients of the parts being sealed and the temperatures used in the sealing process. A typical formulation is as follows: Epoxy (bisphenol-A) 46.5% Diaminodiphenyl sulfone 4.7% Cupric oxide 37.4% Chopped glass 9.4% 3, 4, 4' - tricholorocarbanilide 2.0%

The formulation is blended at 150 degrees C and readily poured onto the back of the module to be sealed which is heated to approximately 125 degrees
C. The epoxy system quickly wets all exposed ceramic surfaces and forms a hermetic seal to the cover.

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