Browse Prior Art Database

Module Connector

IP.com Disclosure Number: IPCOM000085830D
Original Publication Date: 1976-Jun-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Arnhart, J: AUTHOR [+3]

Abstract

The contactor shown in the drawing may be used for testing high pin density modules. It provides a readily separable interface between the module under test and the electronic test system. Basic design of the board contacting area, provides insensitivity to pin spacing tolerances.

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Module Connector

The contactor shown in the drawing may be used for testing high pin density modules. It provides a readily separable interface between the module under test and the electronic test system. Basic design of the board contacting area, provides insensitivity to pin spacing tolerances.

The module connector is composed of two dies 1 and 2 to position the contacts 3. [A third die 6 may be used to provide controlled directional buckling of the contacts 3, if density dictates.] The contacts 3 themselves are composed of electrically conductive material with good spring characteristics. The heads are fabricated by first flame heating and then swaging into its final form.

Upon axial deflection of contacts 3 a uniform contact force is obtained via the buckling beam principle on both the product 4 under test and the tester interfacing board 5. This board provides a space transforming function and may be a multilayer printed-circuit board or a multilayered ceramic.

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