Browse Prior Art Database

Semiconductor Mask Frame and Case

IP.com Disclosure Number: IPCOM000085833D
Original Publication Date: 1976-Jun-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Appenzeller, HA: AUTHOR [+3]

Abstract

The problems inherent in the handling of semiconductor masks are well known in the semiconductor processing industry. As the details in a semiconductor integrated circuit shrink in size, the width of a ridge of the whorls in a fingerprint can cause irreparable damage to certain portions of the semiconductor wafer and blur the image being impressed in the photoresist on the wafer. Accordingly, it is essential that the mask, whether it be of glass or metal, be handled in such a manner as to keep the mask free of contaminants and relatively untouched by human hands.

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Semiconductor Mask Frame and Case

The problems inherent in the handling of semiconductor masks are well known in the semiconductor processing industry. As the details in a semiconductor integrated circuit shrink in size, the width of a ridge of the whorls in a fingerprint can cause irreparable damage to certain portions of the semiconductor wafer and blur the image being impressed in the photoresist on the wafer. Accordingly, it is essential that the mask, whether it be of glass or metal, be handled in such a manner as to keep the mask free of contaminants and relatively untouched by human hands.

Referring to the drawings, in Fig. 1 a case 21 includes a cavity 24 into which a frame 1 carrying a mask (see Fig. 2A) is inserted to maintain the mask with its frame free of ambient contaminants. As shown in Fig. 1, the case 21 includes a sliding gate or tambor 22 which encapsulates or otherwise seals off the cavity 24 with the mask frame 1 therein.

The mask frame 1 includes a central aperture, the mask being bonded to the underside of the frame 1 at the boss 8', and a pin 10. The boss 8' includes a lower cavity 9 (Fig. 2A) which allows epoxy to be placed therein to insure contact at and along one edge of the mask. The pin 10 prevents the mask from sagging while allowing for differential expansion rates when the mask is being cleaned along with the mask frame 1, so that no undo stresses are placed upon the glass or the mask.

The three raised bosses 8 permit the frame 1...