Browse Prior Art Database

Large Scale Integration Diagnostic Technique

IP.com Disclosure Number: IPCOM000085835D
Original Publication Date: 1976-Jun-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Allen, GW: AUTHOR [+4]

Abstract

The infrared technique for determining whether devices are on or off in large-scale integration (LSI) devices depends upon the relative heat dissipation of the on-components. The major problem faced in using the infrared scanning technique for determining whether the components inside the device are on or off, is the presence of large amounts of metallization. The metallization inhibits the microscanner or infrared scanner from seeing the internal circuits.

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Large Scale Integration Diagnostic Technique

The infrared technique for determining whether devices are on or off in large- scale integration (LSI) devices depends upon the relative heat dissipation of the on-components. The major problem faced in using the infrared scanning technique for determining whether the components inside the device are on or off, is the presence of large amounts of metallization. The metallization inhibits the microscanner or infrared scanner from seeing the internal circuits.

As shown in the figure, it has been found that by utilizing a commercial microscanner 10 with an infrared objective 11 thereon, and powering the semiconductor chips or the various parts of the semiconductor wafer 12 desired by a contact probe 13 or the like, the on-off condition of the active semiconductor circuits within the wafer 12 may be viewed on the microscanner 10 from the back side of the wafer. This is because silicon is basically transparent to infrared radiation while aluminum or other metals are not. It is important that in order to see the internal components, that the back surface 12A of the wafer 12 be smooth so as to avoid distortion. In this connection, it is a simple manner to polish the back surface 12A or rear side of the wafer 12 by conventional polishing techniques.

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