Browse Prior Art Database

Electrode Structure

IP.com Disclosure Number: IPCOM000085930D
Original Publication Date: 1976-Jun-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Kirkman, DH: AUTHOR [+2]

Abstract

An electrode construction with connections through a rigid substrate where plated via holes are not suitable, e.g., in a display device, uses a fine stainless steel mesh 1. A pattern of via holes is produced on both sides of the mesh using a thick epoxy insulating material 2 which is then cured. A very low viscosity insulating material is then used to impregnate the structure so as to insulate the mesh 1 without blocking the via holes. Dipping in weak sulphuric acid may be necessary at this stage.

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Electrode Structure

An electrode construction with connections through a rigid substrate where plated via holes are not suitable, e.g., in a display device, uses a fine stainless steel mesh 1. A pattern of via holes is produced on both sides of the mesh using a thick epoxy insulating material 2 which is then cured. A very low viscosity insulating material is then used to impregnate the structure so as to insulate the mesh 1 without blocking the via holes. Dipping in weak sulphuric acid may be necessary at this stage.

The whole structure is then electrolessly copper plated, using vigorous agitation to ensure plating through. Electroplating with pyrophosphate copper follows, and pads 3 are etched to the required dimensions.

Insulation of the mesh 1 may precede the definition of the via holes.

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